Advanced Semiconductor Engineering Inc. Profile

Advanced Semiconductor Engineering, Inc., through its subsidiary, provides semiconductor packaging and testing services.

It offers a range of package types include leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier, and quad flat no-lead package; and package types based on substrates, such as flip-chip BGA and other BGA types, as well as wafer-bumping products.

The company’s testing services include front-end engineering testing, wafer probing, final testing of logic/mixed-signal and memory semiconductors, and other test-related services.

Its packaged semiconductors are used in a range of end-use applications, including communications, personal computers, consumer electronics, industrial, automotive, and other applications.

The company markets its products and services to semiconductor companies in North America, Taiwan, and Europe.

Advanced Semiconductor Engineering was founded in 1984 and is based in Kaohsiung, Taiwan.




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